3/10/2024 0 Comments Datacon 2200 evo manualThe Future of Advanced Packaging Available Today. Datacon’s 2200 evo will suit your laboratory. DATACON 2200 evo The 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Installed and qualified a Datacon 2200 evo plus in 2014 and a. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products. Datacon 2200 Evo Manual Datacon EVO 2200 Automated multi-chip die bonder for positioning and attaching small electronic components on printed circuit board or substrate. Datacon 2200 Evo Manual Sway Rating: 7,9/10 398reviews View Michelle Otten’s profile on. The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.
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